Time: June 20, 2018 to June 22, 2018
Location: Kursaal Congress Center
Street: Avenida de la Zurriola
City/Town: Donostia - San Sebastián
Website or Map: https://www.tecnalia.com/en/s…
Phone: +34 647402258
Event Type: congress
Organized By: TECNALIA
Latest Activity: Sep 27
TECNALIA invites you to participate in the VIII International Congress on Architectural Envelopes, ICAE 2018, which will be held from 20 to 22 June 2018 in Donostia - San Sebastian.
This latest edition will be the eighth and the approach aims to follow the format of the past two editions: a national and international forum enabling the most relevant aspects of the world of envelopes to be discussed whilst staying abreast of the latest developments in the sector through two different but complementary points of view:
During the congress, we want to be able to provide this dual vision, the future and the developments that we envisage for the forthcoming years and the everyday life that we face in 2018.
This event is one of the most important at a national level related to envelopes as it brings together the two aforementioned fields in the same forum: R&D and the market.
The general theme of the congress will be Envelopes 4.0. Under this title, the aim is to unify the two aspects to be fostered in this latest edition:
The architectural envelope, due to it being the main reason for holding the conference and the driving force that has guided the previous seven editions, and Industry 4.0 due to its growing importance in recent years. This importance has been increasing due to the need to improve the manufacturing, assembly, distribution and installation processes of many of the products in order to be competitive in today’s market.
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